Research and Development

  • Crop Protection division’s innovation pipeline boasts new fungicide Revysol®, along with insecticides Inscalis™ and broflanilide
  • Acrodur® Power 2750 X binding agent provides for lighter automotive parts based on natural fibers
  • High-purity Ultramid® EQ plastics offer more protection from corrosion damage in sensitive micro-electronics

We are strengthening our portfolio in the Crop Protection division with innovative products and solutions in all indications for row and specialty crops. The dossier for approval for a new active ingredient, Revysol®, has been submitted to the European Union, marking a key milestone for the compound’s global registration. Revysol® has demonstrated outstanding biological performance against a range of hard-to-control fungal infections and can be used for a number of row and specialty crops worldwide. The first market launches for Revysol® are scheduled for 2019. Two new insecticides are also expected to be available by the end of the decade: Inscalis™ and broflanilide. We project peak sales potential totaling €3 billion in the Crop Protection division for products launched between 2015 and 2025.

Our new Acrodur® Power 2750 X binder allows lightweight automotive composites to comprise up to 75% natural fibers. As a low-emission alternative to formaldehyde-based reactive resins, the product is used in the manufacture of natural-fiber composites. It is not only thermoplastically processable, it also provides components with a high degree of mechanical stability. Compared with traditional plastics, the use of Acrodur® Power 2750 X in natural-fiber components allows for weight savings of up to 40%.

For reliable microelectronics in sensitive automotive applications, we have developed a portfolio of various polyamide-6 and polyamide-66 grades. Thanks to their extreme purity, the various grades of Ultramid® EQ plastics help prevent electric corrosion damage to control unit circuits and safety-related sensors. The plastics ensure that housings and components in fine electronic assemblies do not react with the metals involved, reducing instances of electronic failure.